COMMON FAILURE MODES OF CHIPS: ANALYSIS OF ESD AND EOS

Common Failure Modes of Chips: Analysis of ESD and EOS

Chips often face two primary failure risks during use and production: Electrostatic Discharge (ESD) and Electrical Overstress (EOS). Below is a concise explanation of these failure modes, their characteristics, hazards, and protection measures. Many distributors offer a wide range of electronic components to cater to diverse application needs,

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